Electronic Restoration >> How To Restore Water Damaged Electronics

Prohibited Finishes for Metal Shell Connectors, Contacts, Terminals and Terminal Lugs.Cadmium, zinc, chemically coated cadmium or zinc, or silver shall not be used as a connector or contact finish. Silver shall also not be used as an under plate, and shall not be used as a finish due to corrosion concerns when How To Restore Water Damaged Electronics exposed to atomic oxygen in lower earth orbits. 

Due to the risk of tin whisker growth, which can lead to short circuit conditions, pure tin finishes are prohibited. Preferred Dielectric Materials. The following How To Restore Water Damaged Electronics are preferred dielectric insulating materials for multi-contact connectors (color is optional). Molding compound Diallyl Phthalate (DAP), type SDG-F or type GDI-30F of ASTM-D5948 

Thermoplastics Polyester, glass reinforced, MIL-M-24519 type GPT-30F or type TPES013G-30A0000 perASTM-D5927).Polyphenylene Sulfide (PPS), glass reinforced, MIL-M-24519 type GST-40F or type PPS000G 40A00000 per ASTM-D4067).Liquid Crystalline Polyester, How To Restore Water Damaged Electronics glass reinforced, MIL-M-24519 type GLCP-30F.

Diallyl phthalate is the preferred material for solder applications. PTFE Teflon is the preferreddielectric material for radio frequency and Data Bus connectors. In general, How To Restore Water Damaged Electronics the non-metallicmaterials used in connectors shall be non-combustible or self extinguishing. OUTGASSING Outgassing occurs in vacuum environments when unreacted additives, contaminants, absorbed gasses or moisture can evaporate from molding materials and ink. 

These outgassed materials cancondense on cold surfaces causing performance degradation. Outgassed materials can also becomemore rigid or brittle. Nonmetallic materials shall not exceed 1% Total Mass Loss (TLM) or How To Restore Water Damaged Electronics 0.1% Collected Volatile Condensable Material (CVCM) when tested in accordance with ASTM-E595 (Test Method, Outgassing). 

Acceptable materials should be selected from:NASA Reference Publication 1124 (Outgassing Data for Selecting Spacecraft Materials)http://outgassing.nasa.gov/ - or -MAPTIS (Materials and Process Technical Information Service)http://mpm.msfc.nasa.gov/materialdb.html. However, How To Restore Water Damaged Electronics materials listed as acceptable in these documents may have been baked out prior toevaluation in order to reduce outgassing, and the user needs to be aware that they may have toperform similar processing in order to achieve acceptable levels of outgassing. 

Testing shall be performed per ASTM-E595 for materials that are not How To Restore Water Damaged Electronics traceable to the above references. Processing generally consists of a bakeout at 1250C and 10-6 Torr for 24 hours.CABLE ASSEMBLY TESTING Connectors fabricated with wire into cable assemblies must be tested prior to installation in flight hardware. 

Fabrication and workmanship testing standards are found in NASA-STD-8739.4"Crimping, Interconnecting Cables, How To Restore Water Damaged Electronics Harness and Wiring". These are available on line athttp://workmanship.nasa.gov/index.jsp CRYOGENIC APPLICATIONS The only connectors that are officially rated for use in low temperature cryogenic applications areprocured to MSFC specification 40M38294 (Connectors, Cryogenic; Circular –269°C). 

However,experience has proven it is possible for other connector types to be used successfully at cryogenic temperatures. It is recommended that How To Restore Water Damaged Electronics connector samples should be subjected to five cycles of cryogenic temperature cycling using sufficient low temp to qualify for the intended application.

Perform post temperature cycle inspection at room ambient conditions for cracks and DWV. General.1.1/ The character "X" indicates use as is.1.2/ The test methods, conditions and requirements documented in the screening and qualification tables are intended to summarize commonly used military test methods and How To Restore Water Damaged Electronics procedures that can be performed by users inuser designated test labs or by the manufacturer. 

Complete test details are contained in the referenced test method. 1.3/ When the manufacturer has a more thorough test procedure than the method contained in this document, How To Restore Water Damaged Electronics it is not the intent of this document to impose a procedure of lesser quality, but rather to impose a test when no testis normally performed or no test exists. 

If a manufacturer uses a more thorough test method as part of theirnormal production practice, upon project approval, that test method may continue to be used in lieu of the test How To Restore Water Damaged Electronics contained in this document. The user must provide to the project a brief rationale of its expected comparable effectiveness.1.4/ For a detailed description of available connector configurations, refer to Table 1.

Military circular connectors do not satisfy outgassing requirements of 1% TML and 0.1% CVCM. Other How To Restore Water Damaged Electronics connector types may not meet outgassing requirements depending on configuration. Processing for outgassing control in accordance with Table 2A may be required.3/ Screening to Table 2 is required. 4/ Qualification in accordance with Table 3 is required. 

When a qualification basis can be traced to qualifiedmilitary product, the project may elect to omit qualification on the procured lot, How To Restore Water Damaged Electronics and such decisions shall bedocumented. 5/ Nickel plated D-Subminiature connectors are considered susceptible to magnetic retention, known as residual magnetism. 

Gold plated brass shell connectors are recommended in applications where low residual magnetism must be maintained, How To Restore Water Damaged Electronics but are not guaranteed to have extra low residual magnetism (<200 gamma) unlessspecifically tested to this level. Use of coaxial connectors with lock wire features is preferred.7/ Direct solder attachment of devices with DIP, SIP or small round patterns is preferred. 

When sockets arenecesssary, solder anti-wicking features should be used, and such features shall not permit solder wicking into thecontact that would interfere with mating How To Restore Water Damaged Electronics and performance. 8/ Military triaxial/twinaxial databus connectors have silver plate finish that is not recommended for space flightdue to moisture corrosion and atomic oxygen corrosion concerns. 

Some military suppliers offer an electrolessnickel plated space grade equivalent that is preferred, and such connectors shall meet table 2I requirements.9/ Some nanominiature connectors contain pre-terminated 30 AWG insulated wires. Due to small conductor size, How To Restore Water Damaged Electronics these connectors should be limited to board to board connections within units, and are not recommended for useas unit to unit cable assemblies.

Connectors have the option of pre terminated crosslinked ETFE (Tefzel TM ) insulated wire pigtails. Users areadvised that some ETFE insulations are known to outgas trace amounts of corrosive fluorine. Corrosive effects How To Restore Water Damaged Electronics of fluorine have been observed only when this wire is used with nickel coated metal shell connectors and storedin sealed plastic or ESD bags. 

Connectors should be inspected at receiving for corrosive by products How To Restore Water Damaged Electronics and repackaged until use so that the connectors are protected and the wires are open to air where any outgassed fluorine is free to escape harmlessly. Refer to note 9, screening tables.11/ It is not a requirement for users to prepare a procurement specification for Level 3 programs. 

However, if anexisting procurement specification exists that is proposed for use, as a minimum, How To Restore Water Damaged Electronics the SCD must meet Level 3 requirements in Table 2.12/ Planar filter construction is preferred over tubular.13/ NASA connectors are intended for use with orbital replacement units or to connect spacecraft modules. Military connectors may be used where spacecraft separation from launch vehicle is required. It is not intended for theseconnectors to be mated directly by hand in orbit.

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