Electronic Restoration >> How To Clean Fire Damaged Electronic Circuits

Silicone outgasses and is a concern even in a cable configuration where the outer jacket can protect the system from small amounts of enclosed outgassing material. Current product typically contains relatively large quantities of silicone. The Gore-Tex®construction has not yet been evaluated. The task of stripping polyamide coated fiber is not trivial. Polyamide coating can be stripped only with hot sulfuric acid for space flight applications; hot sulfuric acid can be dangerous How To Clean Fire Damaged Electronic Circuits and is not portable. 

Mechanical stripping methods are not recommended for flight cable assemblies because they can introduce surface flaws to the glass fiber, How To Clean Fire Damaged Electronic Circuits compromising long-term reliability. Connector manufacturers have tried to circumventthis problem by offering a ferrule hole size that will accommodate the unstrippedpolyamide coating's outer diameter. 

This approach has not been accepted readily by theindustry because it makes the connectors considerably more expensive and forces theuser to commit to a non-standard configuration. When used in single mode applications,where perfect alignments are crucial to limiting the insertion losses, How To Clean Fire Damaged Electronic Circuits the polyamide coating still must be removed before terminating the fiber due to the tighter toleranceconstraints of single mode connectors.

Hermetic polyamides over amorphous carbon coatings are susceptible to failure. The failure mode for one loose tube cable configuration was How To Clean Fire Damaged Electronic Circuits determined to be caused bymethod of extrusion. The full analysis is contained in reference 7, the "ISS Fiber OpticFailure Investigation Root Cause Report." There have been no reports of hermeticpolyamide coated optical fiber failures in tight tube configurations. 

Currently,nonhermetic coatings are recommended over hermetic when feasible.CABLESThe standard cable construction includes the coated fiber, which is supplied by a fibermanufacturer and has a unique part number, a tight or loose tube buffer, How To Clean Fire Damaged Electronic Circuits woven or spiraled strength members, and an outer jacket. 

Each cable component performs animportant function in the overall mechanical reliability of the terminated fiber. Thecoating, which is physically in contact with the fiber, greatly affects optical performance.Part number traceability is limited to the finished cable and the coated fiber.The performance and How To Clean Fire Damaged Electronic Circuits manufacturability of cables are heavily dependent on the materialsused. 

Most optical cable jackets considered for use in space flight are extruded Teflon orTefzel. The materials currently in use for loose tube buffers are Teflon, Tefzel, Kynar(PVDF) or Hytrel, tight fiberglass or Kevlar (Aramid). Properties of these How To Clean Fire Damaged Electronic Circuits materials areoutlined in Table 1. A validation test should be conducted on connector ferrule hole dimensions andtolerances prior to procurement. 

This test ensures that the fiber will be reliably centeredin the hole after termination. This How To Clean Fire Damaged Electronic Circuits test is particularly important when inspecting nonstandard ferrule sizes. The ferrule sizes that are commonly used are 125 or 140 microns.An excessive amount of epoxy will be required if the ferrule hole is too large for the barefiber outer diameter. 

The terminated fiber will not mate How To Clean Fire Damaged Electronic Circuits properly to another if amismatch is created due to non-concentric fiber placement within the ferrule. Terminated fiber end faces must be visually inspected at 200X to ensure that the position of the fiberis central to the hole of the ferrule.

MATERIAL OUTGASSING Selection and How To Clean Fire Damaged Electronic Circuits use of non-metallic materials in cables shall be traceable to test reportswith acceptable levels of TML and CVCM as listed in NASA reference publication 1124(outgassing data for selecting spacecraft materials) or NASA MSFC Handbook 527(Materials Selection List for Space Hardware Systems). 

However, materials listed asacceptable in these publications may have been baked out for evaluation, How To Clean Fire Damaged Electronic Circuits and the usermay have to repeat the same processing. This processing usually consists of a vacuumbakeout of 125 °C and a vacuum of 10 -6 TORR for 24 hours.Acrylate optical fiber coating does not pass the ASTM 595E vacuum outgas test.

However, it can be used in a non-outgassing cable configuration. Other materials that areprone to outgassing in a vacuum environment are the epoxies used for terminating assemblies, connector boot materials, cable configuration materials, How To Clean Fire Damaged Electronic Circuits and all plasticconnector parts. In the past Kevlar was considered to be a contamination concern forassemblies; it will absorb 3% of its weight in moisture. 

Any absorbed water shall bedriven off with a thermal preconditioning step prior to How To Clean Fire Damaged Electronic Circuits termination. At present there are only a few epoxies qualified for space flight cable assemblies. Goddard Space Flight Center uses Tra-Con Bipax and Tra-Bond BA-F253 for fiber opticspace flight cable assemblies using the Johanson FC connector. 

EPO-TEK 353ND isused for termination of the Diamond AVIMS. Two epoxies from AngstromBond were recently tested for their outgassing characteristics both inside How To Clean Fire Damaged Electronic Circuits and outside of a cable configuration. The two test epoxies usedin the experiment were the AngstromBond AB9119 and the AngstromBond 9112 fiberoptic epoxies. 

The cable test showed inconclusive results. The ASTM 595  E test conducted on the epoxies alone showed that the Angstrom Bond AB9119 passed whilethe AngstromBond 9112 did not [8].TERMINATIONS The termination process must be well understood How To Clean Fire Damaged Electronic Circuits and controlled in order to reduce thechance of inducing surface crack growth in the fiber. 

Crack growth can be inducedduring any step of the termination process. The proper epoxies and strain relief materialsmust be used to avoid radial or How To Clean Fire Damaged Electronic Circuits lateral stress on the fiber. Crack growth can be a longterm failure mechanism that is difficult to simulate in the laboratory. All terminatedcable assembly preparation work must be performed using space flight procedures including those found in NASA-STD-8739.5, Fiber Optic Terminations, Cable Assemblies, and Installation. 

Termination techniques that are appropriate for highly reliable assemblies in space flight environments are well understood How To Clean Fire Damaged Electronic Circuits and practiced by theAPIM laboratory. Code 562's past experience has been that it is very time consumingand difficult to ensure that commercial vendors fabricate assemblies in compliance withNASA-STD-8739.5. 

Due to this experience, in-house fabrication is recommended. All cable must be thermally preconditioned prior to termination. During terminationchemical stripping is used to remove optical fiber coatings. Performing a strippability validation test is recommended for flight fiber to ensure that space flight termination procedures can be accomplished. Other methods of stripping fiber are available, How To Clean Fire Damaged Electronic Circuits but noneat present have been approved at GSFC for space flight terminations.HANDLING

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